Paper: Optimization of Wafer Exposure Patterns Using a Two-Dimensional Cutting Algorithm

Operational Research paper

Chien, Chen-Fu and Deng, J. (2001), “Optimization of Wafer Exposure Patterns Using a Two-Dimensional Cutting Algorithm,” International Transactions in Operational Research, 8(5), 535-545, DOI: 10.1111/1475-3995.00331. (NSC89-2213-E-007-029) (SSCI) (2020 Impact Factor: 4.193, Rank by JIF: 107/226, 22/84) https://onlinelibrary.wiley.com/doi/abs/10.1111/1475-3995.00331

  • Date: 2001/1/1 04:13
  • Location Hsinchu, Hsinchu City, Taiwan (Map)
  • More Info: IEEM Building 9F, National Tsing Hua University