Name: A Cutting Algorithm for Optimizing the Wafer Exposure Pattern
Start: 01/01/2001 4:01 AM
End: 01/01/2001 4:01 AM

IEEE paper

Chien, Chen-Fu, Hsu, S., and Deng, J. (2001), “A Cutting Algorithm for Optimizing the Wafer Exposure Pattern,” IEEE Transactions on Semiconductor Manufacturing, 14(2), 157-162, DOI: 10.1109/66.920727. (NSC88-2213-E-007-045) (SCI) (2020 Impact Factor: 2.874, Rank by JIF: 114/273, 30/50) https://ieeexplore.ieee.org/abstract/document/920727

Date: 2001/1/1 04:01
Location Hsinchu, Hsinchu City, Taiwan (Map)
More Info: IEEE Building 9F， National Tsing Hua University